Adhesion of fluoropolymer to metal
A laminate is provided comprising a metal substrate and a fluoropolymer layer adhered directly to said metal substrate, said fluoropolymer layer having a recrystallized region at the interface with said metal substrate, the preferred laminate being an electrical cable wherein the metal substrate is...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
21.06.2018
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Subjects | |
Online Access | Get full text |
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Summary: | A laminate is provided comprising a metal substrate and a fluoropolymer layer adhered directly to said metal substrate, said fluoropolymer layer having a recrystallized region at the interface with said metal substrate, the preferred laminate being an electrical cable wherein the metal substrate is an electrical conductor and the fluoropolymer layer is the electrical insulation of the conductor and wherein the opposite surface of the electrical insulation is not recrystallized. |
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Bibliography: | Application Number: TW20143107168 |