Adhesion of fluoropolymer to metal

A laminate is provided comprising a metal substrate and a fluoropolymer layer adhered directly to said metal substrate, said fluoropolymer layer having a recrystallized region at the interface with said metal substrate, the preferred laminate being an electrical cable wherein the metal substrate is...

Full description

Saved in:
Bibliographic Details
Main Authors TURNER, JOHNNIE F, ATEN, RALPH MUNSON, YOUNG, ROBERT THOMAS, BURCH, HEIDI ELIZABETH
Format Patent
LanguageChinese
English
Published 21.06.2018
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A laminate is provided comprising a metal substrate and a fluoropolymer layer adhered directly to said metal substrate, said fluoropolymer layer having a recrystallized region at the interface with said metal substrate, the preferred laminate being an electrical cable wherein the metal substrate is an electrical conductor and the fluoropolymer layer is the electrical insulation of the conductor and wherein the opposite surface of the electrical insulation is not recrystallized.
Bibliography:Application Number: TW20143107168