Composition for non-conductive adhesive film and non-conductive adhesive film including the same

The present invention relates to a composition for a non-conductive adhesive film and a non-conductive adhesive film including the same. According to the present invention, the composition has improved curing speed so a resin flow is minimized in a bonding process between chips and a bonding process...

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Bibliographic Details
Main Authors CHAE, SUNG WON, PARK, DUCK HA, YOON, KEUN YOUNG, LEE, DONG YUL, CHOI, JAE WON
Format Patent
LanguageChinese
English
Published 11.06.2018
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention relates to a composition for a non-conductive adhesive film and a non-conductive adhesive film including the same. According to the present invention, the composition has improved curing speed so a resin flow is minimized in a bonding process between chips and a bonding process of a chip and a substrate. Also, the composition has improved productivity, bump filling properties and adhesion with a semiconductor wafer, has excellent aging properties at room temperature and expresses thermal resistance required in semiconductor products.
Bibliography:Application Number: TW20176111398