TWI623068B

• Main Authors: TAKASE, SHINJI, ONISHI, YOHEI, TAKA, TAKEAKI
• Format: Patent
• Language: Chinese
• Published: 01.05.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Provided is a resin-sealing device capable of balancing suppression of substrate warping and double-sided molding of the substrate. This resin-sealing device resin-seals both surfaces of a substrate by compression molding, and is characterized in that one mold among an upper mold and a lower mold includes a rigid member and a first elastic member, while the other of the molds includes a second elastic member exhibiting a larger spring constant than the first elastic member, and in that: the rigid member stops the movement by an upper-mold frame member or a lower-mold frame member in the direction that opens/closes the upper and lower molds; or a substrate pin is provided on the outside of a lower-mold cavity so as to project upward, and it is possible to mount the substrate pin while the substrate has been released from the top surface of the lower mold; or an outside-air blocking member and a substrate support means are also provided in the resin-sealing device, and while the mold cavity interior is depressu