Epoxy resin composition and prepreg
An embodiment relates to a resin composition containing a tetraglycidyl amine; a bisphenol epoxy; a dicyandiamide; and an aromatic urea; wherein the tetraglycidyl amine has a EEW of 110 g/eq to 140 g/eq and is an amount of 30 to 60 PHR per 100 PHR of total epoxy resin in the resin composition; where...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
21.04.2018
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Subjects | |
Online Access | Get full text |
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Abstract | An embodiment relates to a resin composition containing a tetraglycidyl amine; a bisphenol epoxy; a dicyandiamide; and an aromatic urea; wherein the tetraglycidyl amine has a EEW of 110 g/eq to 140 g/eq and is an amount of 30 to 60 PHR per 100 PHR of total epoxy resin in the resin composition; wherein the resin composition has a Tg of at least 160° C. when cured at 143° C. for 3 min and also maintains a Tg of greater than 160° C. when cured at 177 C for 1 min or longer. |
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AbstractList | An embodiment relates to a resin composition containing a tetraglycidyl amine; a bisphenol epoxy; a dicyandiamide; and an aromatic urea; wherein the tetraglycidyl amine has a EEW of 110 g/eq to 140 g/eq and is an amount of 30 to 60 PHR per 100 PHR of total epoxy resin in the resin composition; wherein the resin composition has a Tg of at least 160° C. when cured at 143° C. for 3 min and also maintains a Tg of greater than 160° C. when cured at 177 C for 1 min or longer. |
Author | SAKATA, HIROAKI HUGHES, JONATHAN C |
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Snippet | An embodiment relates to a resin composition containing a tetraglycidyl amine; a bisphenol epoxy; a dicyandiamide; and an aromatic urea; wherein the... |
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SubjectTerms | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP |
Title | Epoxy resin composition and prepreg |
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