Epoxy resin composition and prepreg

An embodiment relates to a resin composition containing a tetraglycidyl amine; a bisphenol epoxy; a dicyandiamide; and an aromatic urea; wherein the tetraglycidyl amine has a EEW of 110 g/eq to 140 g/eq and is an amount of 30 to 60 PHR per 100 PHR of total epoxy resin in the resin composition; where...

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Bibliographic Details
Main Authors SAKATA, HIROAKI, HUGHES, JONATHAN C
Format Patent
LanguageChinese
English
Published 21.04.2018
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:An embodiment relates to a resin composition containing a tetraglycidyl amine; a bisphenol epoxy; a dicyandiamide; and an aromatic urea; wherein the tetraglycidyl amine has a EEW of 110 g/eq to 140 g/eq and is an amount of 30 to 60 PHR per 100 PHR of total epoxy resin in the resin composition; wherein the resin composition has a Tg of at least 160° C. when cured at 143° C. for 3 min and also maintains a Tg of greater than 160° C. when cured at 177 C for 1 min or longer.
Bibliography:Application Number: TW20143100348