Mounting stage and plasma processing device
PROBLEM TO BE SOLVED: To suppress the unevenness of temperature in a central region and an end region of an object to be processed.SOLUTION: A mounting table comprises: a base portion in which a flow passage for refrigerant is formed; and an electrostatic chuck which has a mounting surface where an...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
11.04.2018
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To suppress the unevenness of temperature in a central region and an end region of an object to be processed.SOLUTION: A mounting table comprises: a base portion in which a flow passage for refrigerant is formed; and an electrostatic chuck which has a mounting surface where an object to be processed is mounted and which electrostatically attracts the object to be treated. The base portion comprises: a first upper surface where the electrostatic chuck is mounted; an annular second upper surface where a focus ring is mounted which is provided at a position outer than the first upper surface and lower than the first upper surface; and a side surface which extends in a vertical direction between the first upper surface and the second upper surface. The flow passage has a central flow passage and a peripheral flow passage. The central flow passage extends under the first upper surface. The peripheral flow passage extends under the second upper surface and includes a part which extends in a di |
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Bibliography: | Application Number: TW20140106079 |