Insulating resin composition for printed circuit board and products using the same

• Main Authors: KIM, JIN YOUNG, MOON, JIN SEOK, LEE, HYUN JUN, YUN, GEUM HEE, JO, DAE HUI, YOO, SEONG HYUN
• Format: Patent
• Language: Chinese; English
• Published: 11.04.2018
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

The present invention provides an insulaton resin composition for a printed circuit board, a prepreg, a copper clad laminate, and a printed circuit board which are manufactured by using the same composition. More specifically, according to an embodiment of the present invention, a curing agent including a bipyridine structure is included in the insulaton resin composition. Therefore, heat-resistant properties, including the glass transition temperature and a coefficient of thermal expansion, and mechanical properties, including separation strength between a metal layer and an insulation layer, are increased.