TWI619807B

The present invention provides a heat insulator that is less bulky than in the related art, has excellent processability, and can be applied to a microstructure, and also provides a manufacturing method by which such a heat insulator can be manufactured. The heat insulator according to the present i...

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Bibliographic Details
Main Authors NAKANISHI, KOTARO, NAKANISHI, EMIKO, UETA, GEN
Format Patent
LanguageChinese
Published 01.04.2018
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Summary:The present invention provides a heat insulator that is less bulky than in the related art, has excellent processability, and can be applied to a microstructure, and also provides a manufacturing method by which such a heat insulator can be manufactured. The heat insulator according to the present invention comprises a main fiber, xerogel and/or aerogel, at least one hydrosoluble polymer selected from the group consisting of a cationic polymer and an ampholytic polymer, and/or a binder including a low-melting-point synthetic fiber, and is characterized in that the xerogel and the aerogel have a density lower than 0.5 g/cm3 and a thermal conductivity of 0.02 W/(m·K) or lower and, in terms of the gross weight, 35-210 parts by weight of the xerogel and/or aerogel are combined with 100 parts by weight of the main fiber.
Bibliography:Application Number: TW20160102397