Method of lithography process with inserting scattering bars

The present disclosure provides one embodiment of an IC method that includes receiving an IC design layout including a first main feature and inserting a first plurality of scattering bars in the IC design layout to form a first circular pattern of scattering bars around the first main feature. The...

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Bibliographic Details
Main Authors HO, YU JU, CHANG, YA HUI, HUNG, AI JEN, LU, KUEI LIANG, HSIEH, HUNG CHANG
Format Patent
LanguageChinese
English
Published 21.03.2018
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Summary:The present disclosure provides one embodiment of an IC method that includes receiving an IC design layout including a first main feature and inserting a first plurality of scattering bars in the IC design layout to form a first circular pattern of scattering bars around the first main feature. The first main feature is positioned at a center portion of the first circular pattern of scattering bars.
Bibliography:Application Number: TW20154140488