PHOTOSENSITIVE RESIN COMPOSITION, AND COLOR RESISTOR STRUCTURE AND DISPLAY USING THE SAME
A photosensitive resin composition includes a colorant, a resin, a photopolymerizable monomer, a photopolymerization initiator and a solvent. The colorant includes a red pigment, which includes at least one of DPP and Br-DPP, and a dye, which includes a silicon atom and has a maximum absorbing wave...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
11.02.2018
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Subjects | |
Online Access | Get full text |
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Summary: | A photosensitive resin composition includes a colorant, a resin, a photopolymerizable monomer, a photopolymerization initiator and a solvent. The colorant includes a red pigment, which includes at least one of DPP and Br-DPP, and a dye, which includes a silicon atom and has a maximum absorbing wave length of 500 nm to 600 nm in chloroform. The resin includes a monomer unit of first type from a monomer of first type, which is an unsaturated compound having a N-cyclohexylmaleimide group, and a monomer unit of second type from a monomer of second type, which is selected from a group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides, wherein the monomer unit of first type takes up at least 50 mol% of the resin. |
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Bibliography: | Application Number: TW20176101508 |