Resin composition, method of manufacturing resin composition, substrate, method of manufacturing electronic device and electronic device

• Main Authors: ZHANG, DONG, UMEDA, HIDEO, JING, JIAOKAI, NAITO, MANABU, INOUE, MIZUHO, SUN, LIMIN, OKADA, JUN, HARRIS, FRANK W, KAWASAKI, RITSUYA
• Format: Patent
• Language: Chinese; English
• Published: 11.02.2018
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

Provided are a resin composition and a substrate that are capable of being used for manufacturing an electronic device including a transparent resin film having an excellent display property, a method of manufacturing such a resin composition and a method of manufacturing the electronic device using such a substrate and the electronic device. The resin composition of the present invention contains an aromatic polyamide, an aromatic multifunctional compound having two or more functional groups including a carboxyl group or an amino group, and a solvent dissolving the aromatic polyamide.