TWI609035B

A thermosetting resin composition and a prepreg containing same, and a laminated plate and a printed circuit board, the thermosetting resin composition comprising the following components in weight percentage of the total thermosetting resin composition: thermosetting resin, curing agent, 15-60 wt%...

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Bibliographic Details
Main Authors LEI, AI-HUA, CHAI, SONG-GANG, HAO, LIANG-PENG
Format Patent
LanguageChinese
Published 21.12.2017
Subjects
ADHESIVES
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PERFORMING OPERATIONS
POLISHES
PREPARATION OF CARBON BLACK
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
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Summary:A thermosetting resin composition and a prepreg containing same, and a laminated plate and a printed circuit board, the thermosetting resin composition comprising the following components in weight percentage of the total thermosetting resin composition: thermosetting resin, curing agent, 15-60 wt% boron nitride, and 0.01-1 wt% nano-diamond. A very small amount of nano-diamond is added into the thermosetting resin for use in combination with the boron nitride, and when uniformly dispersed through the resin solution, the nano-effect of the nano-diamond particles and the synergistic action of same with the boron nitride promotes the formation of a thermally conductive path; in addition, the nano-diamond particles may be filled between boron nitride wafers, having a bridge effect, increasing the contact area of the thermally conductive path, and significantly increasing the thermal conductivity of the material, thereby significantly improving the problem of poor conductivity between boron nitride layers, such th
Bibliography:Application Number: TW20160107815