TWI608899B

The invention provides a method for grinding plate-like objects, capable of suppressing the damage of a plate-like object when the plate-like object grinded thinner is separated from a supporting component. The method comprises a loading step, in which at least one of the surface (S1) of a supportin...

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Bibliographic Details
Main Author SHIMOTANI, MAKOTO
Format Patent
LanguageChinese
Published 21.12.2017
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:The invention provides a method for grinding plate-like objects, capable of suppressing the damage of a plate-like object when the plate-like object grinded thinner is separated from a supporting component. The method comprises a loading step, in which at least one of the surface (S1) of a supporting component (S), which is made of metal and of which the thickness allows the supporting portion to be bent by outer force and the surface (W) of the plate-like object (W1) is coated with a hardened resin (R), and the surface of the plate-like object and the surface of the supporting component are loaded relative to each other; a fixing step, in which ultra-violet rays are irradiated on the hardened resin by way of the plate-like object so as to fix the plate-like object onto the supporting component; a thinning step, in which the supporting component is held by a holding workbench (41), and the back of the plate-like object is grinded to preset thickness; and a removal step, in which the hardened resin is heated o
Bibliography:Application Number: TW20132106002