Partitioned cooling for electronic devices and systems
Partitioned cooling for electronic devices and systems. An embodiment of an apparatus includes a casing; one or more components, including one or more components that include an active thermal element; a partition to separate area within the casing into a first cooling zone and a second cooling zone...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
11.11.2017
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Subjects | |
Online Access | Get full text |
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Summary: | Partitioned cooling for electronic devices and systems. An embodiment of an apparatus includes a casing; one or more components, including one or more components that include an active thermal element; a partition to separate area within the casing into a first cooling zone and a second cooling zone, wherein the first cooling zone provides cooling for the one or more components that include an active thermal element; and a first fan located in the first cooling zone, the first fan to produce airflow for cooling in the first cooling zone and a second fan located in the second cooling zone to produce airflow for the cooling in the second cooling zone. |
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Bibliography: | Application Number: TW20143132424 |