Manufacturing method of package structure and package structure manufactured by the same

• Main Author: HSU, HAN CHENG
• Format: Patent
• Language: Chinese; English
• Published: 01.10.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention provides a manufacturing method for a packing structure and the packing structure obtained via the same. The method comprises the following steps: first, a substrate including a plurality of connection terminals is provided; a positioning tape is attached to the substrate; the positioning tape includes a plurality of positioning openings for exposing the connection terminals; a plurality of chips are respectively arranged in the corresponding positioning openings, and the chips and the connecting terminals are connected to each other through a plurality of connecting conductors; the bonding conductor is subjected to a reflow soldering operation to electrically connect the chip to the connecting terminal, wherein the positioning tape maintains its adhesiveness during the reflow soldering operation; after the reflow soldering operation is performed on the connection conductors, the positioning tape is removed. The invention can effectively help improve the alignment accuracy of the chips a