Method for sorting a light emitting diode wafer

A method for sorting a light emitting diode wafer includes the following steps. A mark die map and a probing die map are obtained, wherein the mark die map records a position of at least one mark die. An image of the wafer is captured through a sorter to produce a first identifying die map. The mark...

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Bibliographic Details
Main Authors OU, SHENG MING, LIN, CHIA WEI, TSAI, CHEN YANG, CHEN, CHIEN FA
Format Patent
LanguageChinese
English
Published 21.09.2017
Subjects
PERFORMING OPERATIONS
POSTAL SORTING
SEPARATING SOLIDS FROM SOLIDS
SORTING
SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING
TRANSPORTING
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Summary:A method for sorting a light emitting diode wafer includes the following steps. A mark die map and a probing die map are obtained, wherein the mark die map records a position of at least one mark die. An image of the wafer is captured through a sorter to produce a first identifying die map. The mark die map, the probing die map and the first identifying map are mapped to produce a sorting map. Dies to be sorted is sorted according to the sorting map through the sorter to produce an after-sorting map. An image of the wafer is captured after sorting to a second identifying die map. The second identifying die map and the after-sorting map are mapped to confirm if positions of the dies remaining on the wafer and the position of the at least one mark die are matched.
Bibliography:Application Number: TW20150113698