Method of chemical mechanical polishing a substrate and polishing system

• Main Authors: SWEDEK, BOGUSLAW A, XU, KUN, BENNETT, DOYLE E, TU, WENIANG, SHEN, SHIH HAUR, CARLSSON, INGEMAR, LIU, TZU YU, IRAVANI, HASSAN G
• Format: Patent
• Language: Chinese; English
• Published: 01.07.2017
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING