Method of chemical mechanical polishing a substrate and polishing system

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Bibliographic Details
Main Authors SWEDEK, BOGUSLAW A, XU, KUN, BENNETT, DOYLE E, TU, WENIANG, SHEN, SHIH HAUR, CARLSSON, INGEMAR, LIU, TZU YU, IRAVANI, HASSAN G
Format Patent
LanguageChinese
English
Published 01.07.2017
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Bibliography:Application Number: TW20130138706