A method of forming a solder composition

A solder composition includes about about 11 % to about 17% by weight tin; about 0.5% to about 3% by weight antimony; about 0.5% to about 1.5% by weight copper; about 0.5% to about 5% by weight nickel; about 72% to about 77% by weight indium; about 4% to about 8.5% by weight silver; and about 0.3% t...

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Bibliographic Details
Main Authors MACKIN, ALEXANDRA M, PEREIRA, JOHN, HWANG, JENNIE S, GONSALVES, JOSEPH C
Format Patent
LanguageChinese
English
Published 21.05.2017
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A solder composition includes about about 11 % to about 17% by weight tin; about 0.5% to about 3% by weight antimony; about 0.5% to about 1.5% by weight copper; about 0.5% to about 5% by weight nickel; about 72% to about 77% by weight indium; about 4% to about 8.5% by weight silver; and about 0.3% to about 1.5% by weight zinc. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.
Bibliography:Application Number: TW20154123697