Method of forming coating using plasma enhanced chemical vapor deposition (pecvd)

The present invention provides novel plasma sources useful in the thin film coating arts and methods of using the same. More specifically, the present invention provides novel linear and two dimensional plasma sources that produce linear and two dimensional plasmas, respectively, that are useful for...

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Bibliographic Details
Main Author MASCHWITZ, PETER
Format Patent
LanguageChinese
English
Published 11.04.2017
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Summary:The present invention provides novel plasma sources useful in the thin film coating arts and methods of using the same. More specifically, the present invention provides novel linear and two dimensional plasma sources that produce linear and two dimensional plasmas, respectively, that are useful for plasma-enhanced chemical vapor deposition. The present invention also provides methods of making thin film coatings and methods of increasing the coating efficiencies of such methods.
Bibliography:Application Number: TW20165103041