THERMO ELECTRIC HEAT DISSIPATION MODULE

A thermoelectric cooling module includes a first circuit board, a second circuit board, first conducting members, second conducting members and TED chips. The first circuit board includes first circuit regions, each having a first conducting layer and first penetrating holes; the second circuit boar...

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Bibliographic Details
Main Authors WANG, CHING-SHUN, CHEN, LEE LONG, CAI, JIN-HONG
Format Patent
LanguageChinese
English
Published 21.12.2016
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A thermoelectric cooling module includes a first circuit board, a second circuit board, first conducting members, second conducting members and TED chips. The first circuit board includes first circuit regions, each having a first conducting layer and first penetrating holes; the second circuit board includes second circuit regions, each having a second conducting layer and second penetrating holes; each first conducting member is passed and fixed into each respective first penetrating hole; each second conducting member is passed and fixed into each respective second penetrating hole; each TED chip is clamped between the first circuit board and the second circuit board, and each first conducting member has an end attached to the TED chip and the other end attached to the first conducting layer, and each second conducting member has an end attached to the TED chip and the other end attached to the second conducting layer.
Bibliography:Application Number: TW20165102796