Integrated circuit packaging system with stacked lead and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching an integrated circuit device to the substrate; forming a stud interconnect having stacked studs, the stud interconnect on the substrate and having a contact surface and a crown surface on an...

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Bibliographic Details
Main Authors BAE, JOHYUN, JANG, KI YOUN, KIM, YOUNGJOON
Format Patent
LanguageChinese
English
Published 21.11.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching an integrated circuit device to the substrate; forming a stud interconnect having stacked studs, the stud interconnect on the substrate and having a contact surface and a crown surface on an end of the stud interconnect opposite the substrate; applying an encapsulation over the integrated circuit die, over the stud interconnect, and over the substrate; and forming a cavity in the encapsulation over the stud interconnect, the contact surface and the crown surface exposed in the cavity.
Bibliography:Application Number: TW20110127345