Resin composition for mold cleaning

• Main Authors: YOSHIMURA, KATSUNORI, SATO, TAICHI, NOMURA, HIROAKI
• Format: Patent
• Language: Chinese; English
• Published: 01.10.2016
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The present invention provides a resin composition for cleaning dies, which contains a melamine resin, a spherical inorganic filler that has a maximum particle diameter of 1-70 mum, a curing catalyst that is selected from among myristic acid and stearic acid, and zinc myristate that is a salt of a saturated fatty acid and a metal.