TWI546718B

The invention provides an integral molding method of a three-dimensional touch module. The integral molding method comprises the following steps: an anti-scraping hardening mold layer on a touch sensor is removed; adhesive is coated on the anti-scraping hardening mold layer for bonding with a three-...

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Bibliographic Details
Main Authors ZHAO, TIAN-XING, WU, JING-YANG, LUO, WEN-KAI
Format Patent
LanguageChinese
Published 21.08.2016
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Summary:The invention provides an integral molding method of a three-dimensional touch module. The integral molding method comprises the following steps: an anti-scraping hardening mold layer on a touch sensor is removed; adhesive is coated on the anti-scraping hardening mold layer for bonding with a three-dimensional curved surface plastic layer (Plastic cover-3D); and the integral molding of the three-dimensional touch module is achieved through connection of a plastic film layer, the anti-scraping hardening mold layer, and the touch sensor The method can solve the problems of increment of manufacturing cost and difficult yield control due to the use of curved surface bonding equipment caused by weak adhesion between the three-dimensional curved surface plastic layer and the anti-scraping hardening mold layer of the touch sensor when the three-dimensional curved surface plastic layer is used in an in-mold forming (IMF) technology.
Bibliography:Application Number: TW20154143923