TWI546156B

The present invention provides a polishing pad conditioning tool and a method of manufacturing the same. The polishing pad conditioning tool includes a sapphire chip body having a specific axial direction and a protection film. The upper surface of the sapphire chip body possesses a micro-structure...

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Bibliographic Details
Main Authors ZHONG, RUN-WEN, LU, QUAN-LANG, SHEN, WEN-YAN, DAI, ZI-XUAN, WEI, KUANG-LING
Format Patent
LanguageChinese
Published 21.08.2016
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:The present invention provides a polishing pad conditioning tool and a method of manufacturing the same. The polishing pad conditioning tool includes a sapphire chip body having a specific axial direction and a protection film. The upper surface of the sapphire chip body possesses a micro-structure and is covered by a protection layer, and the height of the micro-structure is less than 5% of an average height. The method comprises a chip unit formation step in which the sapphire chip having the specific axial direction is formed, an image transfer step in which the micro-structure is formed in a semiconductor process image transfer manner to obtain the sapphire chip body, a thermal treatment step in which the lattice imperfection is reduced and a protection layer formation step in which the protection layer is formed on the sapphire chip body, thereby improving the mechanical, chemical, wear resistant and corrosion resistant effects.
Bibliography:Application Number: TW20132112375