Curable composition

Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ab...

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Main Authors CHOI, BUM GYU, KIM, KYUNG MI, KO, MIN JIN, YANG, YOU NA, PARK, YOUNG JU, CHO, BYUNG KYU, KANG, DAE HO
Format Patent
LanguageChinese
English
Published 21.07.2016
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ability, and crack resistance, even when a semiconductor device to which the composition is applied is used at a high temperature for a long time, performance of the device may be stably maintained.
Bibliography:Application Number: TW20143112711