TWI525754B

Provided are a package and a method of manufacturing the package capable of suppressing corrosion of a bonding material and providing excellent airtightness, and to provide a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio-controlled timepiece. A bonding material formed o...

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Bibliographic Details
Main Author FUNABIKI, YOICHI
Format Patent
LanguageChinese
Published 11.03.2016
Subjects
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION OF NOISE BY SUCH CIRCUITS
GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
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Summary:Provided are a package and a method of manufacturing the package capable of suppressing corrosion of a bonding material and providing excellent airtightness, and to provide a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio-controlled timepiece. A bonding material formed on a front surface of a base substrate is anodically bonded to a frame region of a lid substrate. On the outer surface of a package, a protection film made of a material having higher resistance to corrosion than the bonding material is formed so as to cover at least the bonding material exposed between the base substrate and the lid substrate.
Bibliography:Application Number: TW20110104412