TWI523914B

Provided is a curable resin composition capable of forming a cured product that has excellent heat resistance, transparency, and flexibility and, in particular, offers superior reflow resistance and barrier properties to a corrosive gas. The curable resin composition according to the present inventi...

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Bibliographic Details
Main Authors NAKAGAWA, YASUNOBU, KAMURO, SHIGEAKI
Format Patent
LanguageChinese
Published 01.03.2016
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:Provided is a curable resin composition capable of forming a cured product that has excellent heat resistance, transparency, and flexibility and, in particular, offers superior reflow resistance and barrier properties to a corrosive gas. The curable resin composition according to the present invention includes a polyorganosiloxane (A), a silsesquioxane (B), an isocyanurate compound (C), and a silane coupling agent (D). The polyorganosiloxane (A) is a polyorganosiloxane approximately devoid of aryl groups. The silsesquioxane (B) includes a ladder-like silsesquioxane.
Bibliography:Application Number: TW20143100828