Module substrate and communication module

A module substrate (100) includes: a multilayered wiring substrate (30) that includes wiring layers; and embedded duplexers (40; 40a,40b,40c,40d) that are embedded in the multilayered wiring substrate and electrically connected to the wiring layers, wherein the embedded duplexers include duplexers s...

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Bibliographic Details
Main Authors SASAKI, KEN, TAKEZAKI, TOORU, TASAKA, NAOYUKI
Format Patent
LanguageChinese
English
Published 01.12.2015
Subjects
BASIC ELECTRONIC CIRCUITRY
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
TRANSMISSION
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Summary:A module substrate (100) includes: a multilayered wiring substrate (30) that includes wiring layers; and embedded duplexers (40; 40a,40b,40c,40d) that are embedded in the multilayered wiring substrate and electrically connected to the wiring layers, wherein the embedded duplexers include duplexers supporting at least two bands of Band1, Band2, Band5, and Band8. Duplexers (60) supporting regional bands may be mounted on the multilayered wiring substrate.
Bibliography:Application Number: TW20132144477