Semiconductor resin-molding materia

The invention provides a resin sealing material for a semiconductor which has excellent injectability, inhibits the formation of fillet cracks and voids, and inhibits a reduction in the glass transition temperature. The resin sealing material for a semiconductor is characterized in comprising (A) an...

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Bibliographic Details
Main Authors KOHARA, KAZUYUKI, YAMADA, KANAKO
Format Patent
LanguageChinese
English
Published 11.11.2015
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:The invention provides a resin sealing material for a semiconductor which has excellent injectability, inhibits the formation of fillet cracks and voids, and inhibits a reduction in the glass transition temperature. The resin sealing material for a semiconductor is characterized in comprising (A) an epoxy resin, (B) an amine curing agent, (C) a filler, (D) a core-shell rubber, and (E) a reactive diluent, wherein the reactive diluent (E) is formed from a compound having two or more glycidyl groups in one molecule and the amine curing agent (B) content is 0.5 to 1.5 equivalents per epoxy equivalent of epoxy resin (A) and reactive diluent (E).
Bibliography:Application Number: TW20110127742