TWI502013B

There are provided a cyanate ester resin composition for highly multilayered printed wiring boards for high-frequency applications which exhibits excellent heat resistance and dielectric characteristics and which can yield moldings with an excellent surface appearance, a prepreg prepared using the s...

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Bibliographic Details
Main Authors YAGINUMA, MICHIO, FUKASAWA, EMI, TSUCHIDA, TAKAKI
Format Patent
LanguageChinese
Published 01.10.2015
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:There are provided a cyanate ester resin composition for highly multilayered printed wiring boards for high-frequency applications which exhibits excellent heat resistance and dielectric characteristics and which can yield moldings with an excellent surface appearance, a prepreg prepared using the same, and a metal foil-clad laminated sheet. The resin composition comprises (a) a cyanate ester resin having two or more cyanate groups in the molecule, (b) a bisphenol A epoxy resin having two or more epoxy groups in the molecule, (c) a novolak epoxy resin having two or more epoxy groups in the molecule, (d) a brominated polycarbonate oligomer, (e) a low polymer of styrene and/or a substituted styrene, (f) spherical silica particles having a mean particle diameter of 3 µm or less, and (g) a wetting and dispersing agent.
Bibliography:Application Number: TW20110100638