TWI501708B

• Main Authors: TAJIMA, HIROSHI, KAMINO, KENJI, MORIMOTO, SYOHEI
• Format: Patent
• Language: Chinese
• Published: 21.09.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention relates to a shielded type printed circuit board, which comprises a printed circuit board, a shielding film and a strengthening component. The printed circuit board comprises a base component and an insulation film, wherein a circuit pattern used for ground connection is formed on the base component, the insulation film is arranged on the base component, the circuit pattern used for ground connection is covered by the insulation film, and an electronic component is connected at the installation place of the lower surface of the base component. The shielding film arranged on the printed circuit board comprises an electric conduction layer and an insulation layer, wherein the electric conduction layer is equipotential with the circuit pattern used for ground connection, and the electric conduction layer is arranged on the printed circuit board and is used for covering a part of a zone or the whole zone opposite to the installation place; and the insulation layer is arranged at the electric conduct