Selective linear evaporating apparatus

• Main Authors: JUNG, KI TAEK, SONG, WOOK, CHOI, HO-JOONG, KANG, MYUNG SUNG
• Format: Patent
• Language: Chinese; English
• Published: 11.08.2015
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a selective linear evaporation device.SOLUTION: The selective linear evaporation device according to the present invention includes plural linear evaporation parts, angle limiting plates, a shutter member, and a driving part. The plural linear evaporation parts evaporate raw substances different from each other toward a substrate, and are isolated from each other in a substrate transferring direction. The angle limiting plates are provided at constant height upward of the linear evaporation parts on both sides of the linear evaporation parts, so as to limit a diffusion angle of a raw substance evaporated from the linear evaporation parts. The shutter member is provided between an upper side of the linear evaporation part and the angle limiting plate, and comprises a releasing part for releasing the linear evaporation parts to outside, and a closing part for closing the liner evaporation parts from the outside. The driving part drives the shutter member, so that the releasing p