Adhesive sheet for manufacturing semiconductor device, and semiconductor device manufacturing method using the same

• Main Authors: KASUGA, HIDEMASA, MACHII, SATORU, YAMAI, ATSUFUMI
• Format: Patent
• Language: Chinese; English
• Published: 01.08.2015
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide an adhesive sheet for manufacturing a semiconductor device, which has excellent peelability.SOLUTION: An adhesive sheet 10 for manufacturing a semiconductor device includes a base material and an adhesive layer including a fluorine-containing additive provided on one surface of the base material, and is detachably attached to a lead frame 20 or a wiring board of the semiconductor device. The adhesive layer has surface fluorine recovery calculated by the following formula (1) is 70% and more: surface fluorine recovery (%)=surface fluorine content rate α after recovery÷initial surface fluorine content rate ×100 (1).