Carrier substrate and method for producing semiconductor chip

• Main Authors: DENNEMARCK, JENS, GUENTHER, EWALD KARL MICHAEL, ZULL, HERIBERT, KAEMPF, MATHIAS, BOEHM, BERND, VEIT, THOMAS, PLOESSL, ANDREAS, PERZLMAIER, KORBINIAN
• Format: Patent
• Language: Chinese; English
• Published: 01.07.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method of producing a plurality of semiconductor chips includes a) providing a carrier substrate having a first major face and a second major face opposite the first major face; b) forming a diode structure between the first major face and the second major face, the diode structure electrically in...