TWI490293B

The present invention aims to provide an adhesive composition having high adhesive strength, as well as being easily detachable and having excellent heat resistance, an adhesive tape comprising the adhesive composition, a method for treating a semiconductor wafer using the adhesive tape, and a metho...

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Bibliographic Details
Main Authors TONEGAWA, TORU, SUGITA, DAIHEI, NOMURA, SHIGERU
Format Patent
LanguageChinese
Published 01.07.2015
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HETEROCYCLIC COMPOUNDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC CHEMISTRY
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention aims to provide an adhesive composition having high adhesive strength, as well as being easily detachable and having excellent heat resistance, an adhesive tape comprising the adhesive composition, a method for treating a semiconductor wafer using the adhesive tape, and a method for producing a TSV wafer. The present invention relates to an adhesive composition comprising: an adhesive component; and a tetrazole compound represented by the following formula (1), formula (2), or formula (3), or its salt: wherein R 1 and R 2 each may be hydrogen, a hydroxy group, an amino group, or a C1-C7 alkyl group, alkylene group, phenyl group, or mercapto group; and the C1-C7 alkyl group, alkylene group, phenyl group, and mercapto group may be substituted.
Bibliography:Application Number: TW20110109810