Bonding film composition for semiconductor assembly and bonding film formed of the same

The present invention discloses a bonding film composition used for a semiconductor assembly, comprising an acrylic resin, an epoxy resin, an aromatic amine hardener, a filter and a silane coupling agent. The bonding film composition keeps a low melt viscosity and a high residual curing ratio after...

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Bibliographic Details
Main Authors SONG, KI TAE, UH, DONG SEON, KIM, SANG JIN, KIM, CHEOL SU, CHOI, JAE WON
Format Patent
LanguageChinese
English
Published 01.04.2015
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention discloses a bonding film composition used for a semiconductor assembly, comprising an acrylic resin, an epoxy resin, an aromatic amine hardener, a filter and a silane coupling agent. The bonding film composition keeps a low melt viscosity and a high residual curing ratio after a curing circulation by reducing a curing reaction rate, so that a gap is removed from a moulding process using an epoxy moulding compound (EMC), thereby ensuring a high reliability. The present invention also discloses a bonding film which is formed by the bonding film composition and used for the semiconductor assembly.
Bibliography:Application Number: TW20110125122