Semiconductor package and method for fabricating the same

• Main Authors: LIU, CHENG JEN, SHIH, CHIA KAI, TUNG, SHIH HAO, CHIANG, CHENG CHIA, TSAI, FANG LIN
• Format: Patent
• Language: Chinese; English
• Published: 01.01.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a semiconductor package and a method for manufacturing the same. The semiconductor package comprises a package colloid, a plurality of semiconductor components stacked together and embedded in the package colloid, a conducting layer formed on the semiconductor components and conducting electricity for the semiconductor components, and a line layer formed on the package colloid and electrically connected with the semiconductor components. Since the conducting layer is laid on the surface of the structure formed by stacking the semiconductor components, the package requires no consideration of the height of bonding wireloop compared with the package in which bonding wires are electrically connected with the semiconductor components, and the height of the package colloid can be reduced and the requirement for the miniaturization of the package can be met.