TWI462968B

Disclosed is a heat dissipating material which is interposed between a heat-generating electronic component and a heat dissipating body. This heat dissipating material contains (A) 100 parts by weight of a silicone gel cured by an addition reaction having a penetration of not less than 100 (accordin...

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Bibliographic Details
Main Authors TABEI, SHINGO, HOSHINO, CHISATO
Format Patent
LanguageChinese
Published 01.12.2014
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FUELS
LUBRICANTS
LUBRICATING COMPOSITIONS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PEAT
PETROLEUM, GAS OR COKE INDUSTRIES
SEMICONDUCTOR DEVICES
TECHNICAL GASES CONTAINING CARBON MONOXIDE
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATINGINGREDIENTS IN A LUBRICATING COMPOSITION
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Summary:Disclosed is a heat dissipating material which is interposed between a heat-generating electronic component and a heat dissipating body. This heat dissipating material contains (A) 100 parts by weight of a silicone gel cured by an addition reaction having a penetration of not less than 100 (according to ASTM D 1403), and (B) 500-2000 parts by weight of a heat conductive filler. Also disclosed is a semiconductor device comprising a heat-generating electronic component and a heat dissipating body, wherein the heat dissipating material is interposed between the heat-generating electronic component and the heat dissipating body.
Bibliography:Application Number: TW200796103010