Anti-tarnish coating

A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing th...

Full description

Saved in:
Bibliographic Details
Main Authors ANTONELLIS, THEODORE, SUN, SHENLIANG, ABYS, JOSEPH A
Format Patent
LanguageChinese
English
Published 11.11.2014
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule comprising at least one functional group that interacts with and protects copper surfaces.
Bibliography:Application Number: TW200897144904