Multilayered printed wiring board and method for manufacturing the same
A multilayered printed wiring board includes a flexible wiring board with wiring layers on both main surfaces thereof; a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to the flexible wiring board under the condition that an area of the main surface of the ri...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
21.10.2014
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Subjects | |
Online Access | Get full text |
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Summary: | A multilayered printed wiring board includes a flexible wiring board with wiring layers on both main surfaces thereof; a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to the flexible wiring board under the condition that an area of the main surface of the rigid wiring board is smaller than an area of the main surface of the flexible wiring board; and an electric/electronic component embedded in the rigid wiring board. |
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Bibliography: | Application Number: TW200796126397 |