Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension

Semiconductor light emitting devices are fabricated by placing a suspension (120) comprising particles (122) suspended in solvent (124) on at least a portion of a light emitting surface (110a) of a semiconductor light emitting element (110), and evaporating at least some of the solvent to cause the...

Full description

Saved in:
Bibliographic Details
Main Authors NEGLEY, GERALD H, LEUNG, MICHAEL
Format Patent
LanguageChinese
English
Published 11.09.2014
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
POLISHES
SEMICONDUCTOR DEVICES
SEPARATION
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:Semiconductor light emitting devices are fabricated by placing a suspension (120) comprising particles (122) suspended in solvent (124) on at least a portion of a light emitting surface (110a) of a semiconductor light emitting element (110), and evaporating at least some of the solvent to cause the particles to deposit on at least a portion of the light emitting surface. A coating including the particles is thereby formed on at least a portion of the light emitting surface.
Bibliography:Application Number: TW20121130701