Copper powder for conductive paste and conductive paste

Disclosed is a copper powder which has a good balance between oxidation resistance and electrical conductivity in spite of having a small grain size. Also disclosed is a copper powder for use in an electrically conductive paste, which is reduced in the variations in shape or grain size and has a low...

Full description

Saved in:
Bibliographic Details
Main Authors YOSHIMARU, KATSUHIKO, MIYAKE, KOICHI, KURIMOTO, TORU, UWAZUMI, YOSHIAKI, OTA, KOYU
Format Patent
LanguageChinese
English
Published 01.07.2014
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Disclosed is a copper powder which has a good balance between oxidation resistance and electrical conductivity in spite of having a small grain size. Also disclosed is a copper powder for use in an electrically conductive paste, which is reduced in the variations in shape or grain size and has a low oxygen content. Further disclosed is an electrically conductive paste. In the copper powder for an electrically conductive paste, Si (silicon) is contained in the inside of each particle at a content of 0.1 to 10 atm%.
Bibliography:Application Number: TW200897150817