Copper powder for conductive paste and conductive paste
Disclosed is a copper powder which has a good balance between oxidation resistance and electrical conductivity in spite of having a small grain size. Also disclosed is a copper powder for use in an electrically conductive paste, which is reduced in the variations in shape or grain size and has a low...
Saved in:
Main Authors | , , , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
01.07.2014
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | Disclosed is a copper powder which has a good balance between oxidation resistance and electrical conductivity in spite of having a small grain size. Also disclosed is a copper powder for use in an electrically conductive paste, which is reduced in the variations in shape or grain size and has a low oxygen content. Further disclosed is an electrically conductive paste. In the copper powder for an electrically conductive paste, Si (silicon) is contained in the inside of each particle at a content of 0.1 to 10 atm%. |
---|---|
Bibliography: | Application Number: TW200897150817 |