Chuck structure and device for processing semiconductor substrate using the same

PURPOSE: A chuck structure and a semiconductor substrate processing apparatus using the same are provided to prevent the generation of uneven temperature gradient at chuck by omitting a lift pin for loading and unloading a substrate. CONSTITUTION: A main body(12) supports a chuck(14). A heating elem...

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Bibliographic Details
Main Authors PARK, DONG JUN, HAN, KYO SHIK, LEE, SEONG JAE, CHOI, IN GYU
Format Patent
LanguageChinese
English
Published 01.05.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A chuck structure and a semiconductor substrate processing apparatus using the same are provided to prevent the generation of uneven temperature gradient at chuck by omitting a lift pin for loading and unloading a substrate. CONSTITUTION: A main body(12) supports a chuck(14). A heating element is placed inside the chuck. A fixing guide ring(20) is mounted on the outer circumference of the chuck. Moving guide rings(32a,32b) are driven upwards and downwards in the moving guide ring mounting units(22a,22b) formed on the fixing guide ring. The moving guide rings are connected to a moving guide ring connection unit. A drive pin(16a) moves the moving guide rings upwards and downwards. An arrangement groove is formed on the moving guide rings for settling a substrate.
Bibliography:Application Number: TW20110130183