Semiconductor device and method for fabricating the same
A semiconductor device includes a substrate including a trench, a buried gate filling a part of the trench, an inter-layer dielectric layer formed on the buried gate to gap-fill the rest of the trench, and a protection layer covering substantially an entire surface of the substrate including the int...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.04.2014
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor device includes a substrate including a trench, a buried gate filling a part of the trench, an inter-layer dielectric layer formed on the buried gate to gap-fill the rest of the trench, and a protection layer covering substantially an entire surface of the substrate including the inter-layer dielectric layer. |
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Bibliography: | Application Number: TW200998127944 |