Solder bump forming method

A method for forming a solder bump is provided to mount a conductive ball on each pad installed in a substrate without using a mask. A metal layer(151) is formed on a plurality of pads. A tackifying compound chemically reacts on the metal layer. An organic sticking layer is formed on the metal layer...

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Main Authors MASAKI SANADA, KINJI NAGATA, MASAO NAKAZAWA, TADASHI KODAIRA, MASARU YAMAZAKI, KEI IMAFUJI, KENJIRO ENOKI, SACHIKO ODA
Format Patent
LanguageChinese
English
Published 21.02.2014
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A method for forming a solder bump is provided to mount a conductive ball on each pad installed in a substrate without using a mask. A metal layer(151) is formed on a plurality of pads. A tackifying compound chemically reacts on the metal layer. An organic sticking layer is formed on the metal layer by the chemical reaction of the solution including the tackifying compound and the metal layer. A conductive ball(129) is supplied on the organic adhesion layer. The conductive ball is mounted on the pads through the organic sticking layer and the metal layer. The reflow process is performed on the mounted conductive ball.
Bibliography:Application Number: TW200897127081