Process for manufacturing semiconductor chip packaging module

A process for manufacturing a semiconductor chip packaging module is provided, which includes: providing a chip carrier which includes a substrate and a carrier film formed on the substrate; placing a chip on the carrier film; pressing the chip into the carrier film; hardening the carrier film; form...

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Bibliographic Details
Main Authors HSIUNG, CHIEN KANG, TSAI, BIN HONG
Format Patent
LanguageChinese
English
Published 01.02.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A process for manufacturing a semiconductor chip packaging module is provided, which includes: providing a chip carrier which includes a substrate and a carrier film formed on the substrate; placing a chip on the carrier film; pressing the chip into the carrier film; hardening the carrier film; forming a first dielectric layer over the chip and the carrier film; and forming a circuitry in the first dielectric layer to provide electrical connection to the chip.
Bibliography:Application Number: TW200998130416