TWI415200B

• Main Author: AMAKAWA, TSUYOSHI
• Format: Patent
• Language: Chinese
• Published: 11.11.2013
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Regarding a singulation apparatus for singulating a resin encapsulated substrate to manufacture an electronic component, the present invention brings about shortening the delivery period, reducing the footprint, and reducing the cost inc compliance with a specification requested by a user. A singulation apparatus S2 for an electronic component has: a basic unit including a receiving unit A, singulation unit B, and delivery unit C; a cleaning unit D mounted between the singulation unit B and the delivery unit C; and an examination unit E mounted on the cleaning unit D. The singulation unit B is appropriately selected in accordance with the requested specification by the user, and a cutting mechanism used in the singulation unit B has a rotary blade 7, water jet, laser light, wire saw, band saw, etc. The cleaning unit D and examination unit E, both mounted on the basic unit, are each appropriately selected and mounted in accordance with the requested specification by the user. The cleaning unit D and examinatio