Multilayer printing wire board and method for producting the same

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Bibliographic Details
Main Authors TAKII, HITOSHI, YAGI, NARITO, HAYASHI, NORIKI, OKA, YOSHIO
Format Patent
LanguageChinese
English
Published 11.10.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Bibliography:Application Number: TW20060137337