Resin composition, prepreg, and laminated board

A resin composition used to prepare a sheet-like prepreg by impregnating a substrate with the resin composition includes an epoxy resin that contains a naphthalene-modified epoxy resin, and a triazine-modified novolac resin. A sheet-like prepreg is formed by impregnating a substrate with the resin c...

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Bibliographic Details
Main Author AKIHIKO TOBISAWA
Format Patent
LanguageChinese
English
Published 01.09.2013
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
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Summary:A resin composition used to prepare a sheet-like prepreg by impregnating a substrate with the resin composition includes an epoxy resin that contains a naphthalene-modified epoxy resin, and a triazine-modified novolac resin. A sheet-like prepreg is formed by impregnating a substrate with the resin composition. A laminate formed using the prepreg exhibits excellent flame retardancy, solder heat resistance, and lead-free heat resistance, has a small coefficient of linear expansion in the thickness direction, and has excellent adhesion to a conductor circuit.
Bibliography:Application Number: TW200796135330